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Amkor Breaks Ground on $7 Billion Arizona Project Amid US Chipmaking Rebound

The facility is among a wave of semiconductor projects benefiting from subsidies and incentives to shore up domestic chip manufacturing.
Amkor Breaks Ground on $7 Billion Arizona Project Amid US Chipmaking Rebound
Semiconductor chips are seen on the circuit board of a computer on Feb. 25, 2022. Reuters/Florence Lo/Illustration/File Photo
Greg Isaacson
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Commentary

Arizona-based Amkor Technology broke ground last week on a $7 billion semiconductor packaging facility northwest of Phoenix that will support customers including Apple and Nvidia, as the United States continues to ramp up efforts to revitalize its chip manufacturing industry.

Greg Isaacson
Greg Isaacson
Author
Greg Isaacson spent 7 years in China and Thailand researching and reporting on business and real estate in Asia, with a focus on commercial real estate in Chinese-speaking markets as well as outbound investment from China. He has also worked as a real estate research analyst in Chicago and a real estate reporter in New York.
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