Taiwan’s TSMC Raises $3.5 Billion in Bonds for New US Plant

The logo of Taiwan Semiconductor Manufacturing Co. (TSMC) at its headquarters in Hsinchu, Taiwan, on Jan. 19, 2021. (Ann Wang/Reuters)

TAIPEI—Taiwanese chip firm TSMC has raised $3.5 billon in bonds for its new plant in the U.S. state of Arizona, according to a term sheet.

Taiwan Semiconductor Manufacturing Co. Ltd., a major Apple Inc supplier and the world’s largest contract chip-maker, started construction last year at the Arizona site where it plans to spend $12 billion to build a computer chip factory.

By Ben Blanchard and Scott Murdoch