The iPhone 6 could be launched in June amid reports that Apple has tapped into semiconductor companies to supply the next-gen “A8” mobile processor.
DigiTimes reported that three semiconductor companies–Amkor Technology, STATS ChipPAC and Advanced Semiconductor Engineering–will handle the packaging of the newest iPhone processor and other Apple devices.
“Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken over by Advanced Semiconductor Engineering (ASE), according to industry sources,” says DigiTimes, a Taiwan-based tech website.
The Taiwan Semiconductor Manufacturing Company also is believed to be ramping up production on A8 chips in the second quarter of 2014. Apple currently uses the A7 chip for the iPhone 5s, iPad Air, and the iPad mini Retina.
Citing Chinese analyst Sun Changxu, Tech Radar notes that the iPhone 6 could be here as early as June. That would be for the 4.7-inch and 1136 x 640 resolution variant, and it could be unveiled at WWDC.
Reports earlier this month indicate that the iPhone 6 will come in two variants: a 4.7-inch model and a 5.5-inch model, but another says that Apple has “locked down” a 4.8-inch variant, said Cowen and Company analyst Timothy Arcuri, citing “checks” in the company’s supply chain.