Toshiba Corporation on Friday announced that it will build a new 300-millimeter wafer fabrication facility to increase its power semiconductor production capacity by March 2025.
A Toshiba spokesperson said the Japanese industrial conglomerate will invest around 100 billion yen ($873 million) in the new plant, on top of a 25 billion yen ($217 million) investment in a 300-millimeter fabrication line it is building at an existing chip plant.
