Intel will invest 30 billion ringgit, a little over $7 billion, in a cutting-edge semiconductor packaging facility in Penang, a northwest state of Malaysia, the country’s authorities said on Monday.
The investment will add to the company’s advanced chip packaging capabilities already on the island state. More details on the deal are expected at Wednesday’s Kuala Lumpur airport press briefing involving Intel CEO Pat Gelsinger along with Malaysia’s trade minister, Azmin Ali, and the CEO of the Malaysian Development Authority, Arham Abdul Rahman.
